DK208D - DK208D Series

Series: DK208D
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Thyristor DK208D Image
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This DK208D 8A, 1200V rated standard recovery rectifier diode in a compact TO-252 surface mount package is ideal as a bypass diode or anti-parallel diode for active switching component.

Features:

  • Standard recovery rectifier
  • Voltage capability up to 1200 V
  • 50Hz surge capability up to150A
  • High di/dt capability
  • Halogen free and RoHS compliant

Applications:

Typical applications are high voltage pulse generator using capacitor discharge such as electric fences and stun guns, and high voltage DC to DC converter seen in small EV / E-bike charger systems.

Check Stock Order Samples
Property (Mouseover for details) Value
RMS Forward Current (IFRMS) (A) 15
Max Reverse Current (VFM) (V) 1.6
Max Repetitive Reverse Voltage (VRRM) (V) 200

pdficon Discrete Thyristors DK208D Series Datasheet

pdficon Thyristor Fundamental Characteristics of Thyristors Application Note

The thyristor family of semiconductors consists of several very useful devices. The most widely used of this family are silicon controlled rectifiers (SCRs) triacs sidacs and diacs. In many applications these devices perform key functions and are real assets in meeting environmental speed and reliability specifications which their electro-mechanical counterparts cannot fulfill. This application note presents the basic fundamentals of SCR triac sidac and diac thyristors so the user understands how they differ in characteristics and parameters from their electromechanical counterparts. Also thyristor terminology is defined.
pdficon Mounting and Handling of Semiconductor Devices Application Note

Proper mounting and handling of semiconductor devices particularly those used in power applications is an important yet sometimes overlooked consideration in the assembly of electronic systems. Power devices need adequate heat dissipation to increase operating life and reliability and allow the device to operate within manufacturers' specifications. Also in order to avoid damage to the semiconductor chip or internal assembly the devices should not be abused during assembly. Very often device failures can be attributed directly to a heat sinking or assembly damage problem. The information in this application note guides the semiconductor user in the proper use of Teccor devices particularly the popular and versatile TO-220 and TO-202 epoxy packages.
pdficon Thyristor Miscellaneous Design Tips and Facts Application Note

This application note presents design tips and facts on the following topics: -Relationship of IAV IRMS and IPK -dv/dt Definitions -Examples of gate terminations -Curves for Average Current at Various Conduction Angles -Double-exponential Impulse Waveform -Failure Modes of Thyristor -Characteristics Formulas for Phase Control
pdficon AN1006 Testing Teccor Semiconductor Devices Using Curve Tracers

One of the most useful and versatile instruments for testing semiconductor devices is the curve tracer (CT). Although widely used by semiconductor
pdficon Surface Mount Soldering Recommendations Application Note

The most important consideration in reliability is achieving a good solder bond between surface mount device (SMD) and substrate since the solder provides the thermal path from the chip. A good bond is less subject to thermal fatiguing and will result in improved device reliability. This application note discusses the different soldering methods for Littelfuse's Teccor brand thyristor products.
pdficon Circuit Protection Technology Application Matrix

Littelfuse is the world leader in the design and manufacturing of fuses for the automotive industrial handheld computer and telecom markets...
pdficon Circuit Protection Products Selection Guide

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