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MMIX2F60N50P3
Disc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B | Series: HiPerFET and MOSFET
Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.
Configurations:
- Buck
- Boost
- Full-bridge
- Half-bridge
- Phase leg
- Single
| Property | Value |
|---|---|
VDSS (V) | 500 |
RDS(ON),max @ 25 °C (Ω) | 0.11 |
ID, cont @ 25 °C (A) | 30 |
Gate Charge (nC) | 96 |
RthJC (K/W) | 0.39 |
Configuration | Single |
Package Type | SMPD |
CISS (pF) | 6250 |
PD (W) | 320 |
trr,max (ns) | 250 |
- Ultra-low and compact package profile
- Surface mountable via standard reflow process
- Low package weight
- Up to 4.5 kV ceramic isolation (DCB)
- Low package inductance
- Excellent thermal performance
- High power cycling capability
MMIX2F60N50P3 Applications
- Battery chargers
- Switching and resonant power supplies
- Dc choppers
- Dc-dc converters
- Temperature and Lighting controls
- Motor drives
- E-bikes and electric and hybrid vehicles
- Solar inverters
- Induction heaters
MMIX2F60N50P3 Resources
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| Part Number | Part Description | RoHS | Pb-Free | RoHS (2015/863/EU) Certificate | REACH (SVHC's) Declaration | REACH (SVHC's) | Halogen Free | IPC-Material Declaration | |
|---|---|---|---|---|---|---|---|---|---|
| MMIX2F60N50P3 | Disc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B | View More |
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