Link has been copied to clipboardSeries: HiPerFET and MOSFET
40V - 1100V HiPerFETs and MOSFETs in Surface Mount Power Device (SMPD) Packages
Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.
Configurations:
- Buck
- Boost
- Full-bridge
- Half-bridge
- Phase leg
- Single
- Ultra-low and compact package profile
- Surface mountable via standard reflow process
- Low package weight
- Up to 4500V ceramic isolation (DCB)
- Low package inductance
- Excellent thermal performance
- High power cycling capability
HiPerFET and MOSFET Parts
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HiPerFET and MOSFET Applications
- Battery chargers
- Switching and resonant power supplies
- DC choppers
- DC-DC converters
- Temperature and Lighting controls
- Motor drives
- E-bikes and electric and hybrid vehicles
- Solar inverters
- Induction heaters
