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MMIX1F180N25T

Product Status| Activei

MMIX1F180N25T

Disc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B | Series: HiPerFET and MOSFET
info

Weighing only 8g, the SMPD package is much lighter (typically by 50%) than comparable conventional power modules, thereby enabling lower weight power systems. Due to its compact and ultra-low profile package, it is possible to use the same heat sink for multiple devices, saving PCB space. An added benefit of being smaller and lighter is that it provides better protection against vibrations and g-forces, especially if used in portable appliances, increasing the life expectancy and reliability of these devices.

Configurations:

  • Buck
  • Boost
  • Full-bridge
  • Half-bridge
  • Phase leg
  • Single
PropertyValue
VDSS (V)
250
RDS(ON),max @ 25 °C (Ω)
0.013
ID, cont @ 25 °C (A)
132
Gate Charge (nC)
364
RthJC (K/W)
0.22
Configuration
Single
Package Type
SMPD
CISS (pF)
23800
PD (W)
570
trr,max (ns)
200
  • Ultra-low and compact package profile
  • Surface mountable via standard reflow process
  • Low package weight
  • Up to 4.5 kV ceramic isolation (DCB)
  • Low package inductance
  • Excellent thermal performance
  • High power cycling capability

MMIX1F180N25T Applications

Highlights Section

  • Battery chargers
  • Switching and resonant power supplies
  • Dc choppers
  • Dc-dc converters
  • Temperature and Lighting controls
  • Motor drives
  • E-bikes and electric and hybrid vehicles
  • Solar inverters
  • Induction heaters

MMIX1F180N25T Resources

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Part NumberPart DescriptionRoHSPb-FreeRoHS (2015/863/EU) CertificateREACH (SVHC's) DeclarationREACH (SVHC's)Halogen FreeIPC-Material Declaration
MMIX1F180N25TDisc MSFT SMPD Pkg-HiPerFET&MSFT SMPD-B

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