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IXYP20N65C3D1

Product Status| Activei

IXYP20N65C3D1

Disc IGBT XPT-GenX3 TO-220AB/FP | Series: Planar
info

Manufactured through the state-of-the-art GenX3™ IGBT process and an extreme-light Punch Through (XPT™) design platform, these devices feature high-current handling capabilities, high-speed switching abilities, low total energy losses, and low current fall times. They have a positive collector-to-emitter voltage temperature coefficient, making it possible for designers to use multiple devices in parallel to meet high current requirements.

Their low gate charges also help reduce gate drive requirements and switching losses. These devices have square Reverse Bias Safe Operating Areas (RBSOA) up to the breakdown voltage – a necessary ruggedness in snubberless hard-switching applications.

Advantages:

  • Hard-switching capability
  • High power density
  • Low gate drive requirements
PropertyValue
VCES (V)
650
IC @ 25 °C (A)
50
VCE(sat) (V)
2.5
tfi (ns)
28
Configuration
Copack (FRED)
Package Type
TO-220U
Status
Active
RthJC [IGBT] (K/W)
0.65
Eoff @ 150 °C (mJ)
0.4
IC @ 110 °C (A)
20
RthJC [Diode] (K/W)
1.85
Forward Current @ 110 °C (A)
18
  • Optimized for mid- and high-switching frequencies
  • Square RBSOA
  • Short circuit capability
  • Ultra-fast anti-parallel diodes
  • International standard package

IXYP20N65C3D1 Applications

Highlights Section

  • Battery chargers
  • E-Bikes
  • Lamp ballasts
  • Power inverters
  • Power Factor Correction (PFC) circuits
  • Switched-mode power supplies
  • Uninterruptible Power Supplies (UPS)
  • Welding machines

IXYP20N65C3D1 Resources

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Part NumberPart DescriptionRoHSPb-FreeRoHS (2015/863/EU) CertificateREACH (SVHC's) DeclarationREACH (SVHC's)Halogen FreeIPC-Material Declaration
IXYP20N65C3D1Disc IGBT XPT-GenX3 TO-220AB/FP

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