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Our Surface Mount Power Device (SMPD) packaging technology is an expansion of the ISOPLUS™ package portfolio to include modules that can be assembled in standard surface mount (SMD) soldering processes and is pick-and-place ready to be assembled on a customer’s existing SMD assembly lines.
Our SMPD range provides a large array of standard options in terms of topology or silicon varieties. Its simplicity and optimized manufacturing process enables fast time to market for customers that require differing die and circuit combinations effectively fast tracking product development. Numerous discrete devices can be successfully combined in one high reliability package that can then be easily assembled on current SMD assembly lines.
- Ultra-low and compact package profile
- Surface mountable via standard reflow process
- Low package weight
- Up to 4500V ceramic isolation (DCB)
- Low package inductance
- Excellent thermal performance
- High power cycling capability
BiMOSFETs Parts
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Showing 1 to 3 of 3 Total Results
| Not for New Designs | 3000 | 26 | 3.2 | Copack (FRED) | SMPD | 540 | 1 | 11 | |||||
| Not for New Designs | 3000 | 34 | 3.2 | Copack (FRED) | SMPD | 504 | 0.83 | 14 | |||||
| Active | 3000 | 38 | 2.7 | SMPD | 205 | 0.83 | 22 | 15 |
BiMOSFETs Applications
- Battery chargers
- Switching and resonant power supplies
- DC choppers
- DC-DC converters
- Temperature and Lighting controls
- Motor drives
- E-bikes and electric and hybrid vehicles
- Solar inverters
- Induction heaters
