
Series: 466
SlimLine Lead-Free Halogen-Free 1206 Very Fast-Acting Thin-Film Fuse
The 466 Series Fast-Acting Surface Mount Fuse (SMF) is a small (1206 size) thin-film device designed for secondary protection of circuits used in space constrained applications such as hand-held portable electronic devices. This series is 100% lead-free and meets the requirements of the RoHS directive. New Halogen-Free 466 Series fuses are available to order using the “HF” suffix. See Part Numbering section for additional information.
- Product is compatible with lead-free solders and higher temperature profiles
- Product is marked on top surface with code to allow amperage rating identification without testing
- Low profile for height sensitive applications
- Flat top surface for pickand-place operations
- Element-covering material is resistant to industry standard cleaning operations
- Alloy-based element construction provides superior inrush withstand characteristics (I2t) over ceramic or glass-based 1206 chip fuse products
- Lead-free, Halogen-free and RoHS compliant
466 Parts
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Showing 1 to 12 of 15 Total Results
Part Number | Actions | Voltage Rating (V) | Maximum AC Voltage (V) | Nominal Melting I2T (A2sec) | Resistance (Ω) | Body | Opening | Operating Temperature | Agency Approvals |
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Part Number | Actions | Voltage Rating (V) | Maximum AC Voltage (V) | Nominal Melting I2T (A2sec) | Resistance (Ω) | Body | Opening | Operating Temperature | Agency Approvals | |
---|---|---|---|---|---|---|---|---|---|---|
125 | 125 | 0.00064 | 3.925 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
125 | 125 | 0.00055 | 1.1 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
125 | 125 | 0.0022 | 0.691 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
125 | 125 | 0.0045 | 0.351 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
63 | 63 | 0.006 | 0.248 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
63 | 63 | 0.0276 | 0.106 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / TUV / CE | |||
63 | 63 | 0.064 | 0.057 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
63 | 63 | 0.1835 | 0.038 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
63 | 63 | 0.1103 | 0.046 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / TUV / CE | |||
32 | 32 | 0.3516 | 0.023 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
63 | 63 | 0.0423 | 0.075 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV | |||
63 | 63 | 0.2326 | 0.03 | Advanced High Temperature Substrate | Very Fast-Acting (FF) | -55° to 90°C | UR / CE / TUV |
466 Applications
- Secondary protection for space constrained applications:
- Cell phones
- Battery packs
- Digital cameras
- DVD players
- Hard disk drives