Sensor Manufacturing Process Capabilities

Plastic Assembly:

• Injection Molding

• Ultrasonic Welding

• Heat Staking

Encapsulation:

• Transfer Over-Mold

• Low-Pressure Over-mold

• Epoxy/Urethane Potting

• Meter/Mix Dispensing

Assembly Methods:

• Automated

• Cellular

• Manual

Custom Magnet Solutions:

• Magnetic simulation and modeling for customer specific designs

• Integral magnets within the sensor

• Magnetic circuits with tight tolerances available

• Magnetic actuation mapping

Wire Harness and Termination Equipment:

• Automatic Cut, Strip, and Crimp

• Apply customer-specified wire/cable and connectors
• Over-molding of connector to wire/cable sealing options available

100% End of Line Testing:

• Hermetic Seal Test

• Magnetic Actuation

• Contact Resistance

Reed Switch and Hall Effect:

• Automatic Switch Assembly Machines

• Custom reed switch forming equipment

• Automated Testing

• Automatic Cut and Form

• Tape + Reel packaging for SMD and other custom design requirements.

Circuit Board Assembly:

• Vision Systems

• In-Circuit-Test

• Pick and Place

• Reflow soldering

• Wave soldering

• Robotic soldering